Coupling mechanism for a PCB mounted microwave re-entrant resonant cavity
Originating portfolio: ALU
Estimated expiration: 2031-Jul-19
Listed For Sale
Initial bid date: 2018-May-01
Potentially relevant companies (4): Analog Devices, Inc., Broadcom Corporation, Marvell International Ltd., Taiwan Semiconductor Manufacturing Company, Ltd.
Products & technologies (2): Electronics:Circuit Board, Electronics:Connectors
The microwave signals are coupled from a transmission line embedded in a Printed Circuit Board PCB to a resonant cavity mounted on an external metalized surface of this PCB. The coupling mechanism implements an easy-to-fabricate mechanism leading to high-quality filtering owing to the fact that the end of the transmission line is provided with a metalized feeding pad located at the external layer of the PCB inside the resonant cavity. The resonant cavity is provided with a re-entrant inner stub orthogonal to the PCB and separated from the PCB by a capacitive gap. The metalized feeding pad is facing the inner stub in the area of the capacitive gap and is offset from the axial direction of this inner stub. The metalized feeding pad is further separated from the external metalized surface of the PCB by a surface capacitive gap.
1. An apparatus, comprising:
a printed circuit board PCB having a first surface;
a resonant cavity mounted on the first surface, the resonant cavity including a first stub orthogonal to the first surface and separated from the first surface by a first gap;
a first transmission line embedded in the PCB;
a first metalized feeding pad electrically connected to the first transmission line, the first metalized feeding pad at the first surface, a distance between the first metalized feeding pad and the first stub being substantially equal to the first gap, at least a portion of the first metalized feeding pad overlapping with at least a first portion of the first stub in an axial direction of the first stub.
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